Research Project Information

Research Project Summary Information

Direct Writing of Nanometer-Sized Metal and Dielectric Materials:Develop Energy-efficient Process forDirect Writing of Nanometer-Sized Metal on Dielectric Materials(ST9865-1)

Micropen Technologies Corporation


Subtractive fabrication techniques used in the semiconductor and microsystems manufacturing industries, while extremely effective, are very energy and capital intensive. Removal of the deposited material involves a complex schedule of processing steps and generates significant effluent streams to be treated, recycled, or disposed. Additive techniques for deposition of materials involve a single processing step because they deposit the material only where it is needed. Traditionally, additive techniques have been constrained by limited minimum feature size and line width control. Ohmcraft is working to develop formulations of nanoparticle inks suitable for use with their CAD driven MicroPen device to advance the technology of additive manufacturing techniques.

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Project Description

The primary goal of this project is to develop formulations of nanoparticle based inks suitable for direct writing to ceramic wafer substrates that provide superior deposition and final film characteristics, reducing or eliminating energy intensive subtractive manufacturing techniques.


Elimination of manufacturing steps and lowering of process temperatures will have significant energy reduction benefits for manufacturers choosing to adopt this technology. Reduction of significant waste streams generated by the removal of material in subtraction processes will be realized.

Project Results


Micropen Technologies Corporation
93 Papermill St
Honeoye Falls, NY 14472

Principle Investigator

Walt Mathias

Universities Involved


Project Type:

Product Development

Technologies Types:

Industrial Products

NYSERDA Contact Information

Edward Kear


R&D - Mfg Tech & On-Site Pwr

Contract Details

Start Date: 1/11/2010
Project Status: Active
Contract Number: ST9865-1

Last Updated: 9/10/2014